Looking forward to smart car chip companies busy with M & A
On June 23, SMIC announced that SMIC, together with Huawei, Belgium Microelectronics Research Center (IMEC) and Qualcomm, had jointly invested in the establishment of SMIC new technology research and development (Shanghai) Co., Ltd. to develop the next generation of CMOS logic process, with the initial stage focusing on the research and development of 14 nanometer logic process.
This cooperation highlights the strategic intention of the country to expand and strengthen the semiconductor industry, and SMIC will undoubtedly be the biggest beneficiary. On the one hand, the world's leading IC design companies participate in joint R & D in the early stage of process finalization, which helps to shorten the product R & D cycle and share the R & D cost; on the other hand, SMIC has bound large customers such as Huawei and Qualcomm through cooperation. Huawei believes that this cooperation will benefit more operators, enterprises and consumers, as well as industrial chain partners. Qualcomm's participation in this cooperation is mainly due to the great opportunity of China's semiconductor industry, and it hopes to participate in more projects led by the Chinese government and enterprises to get rid of the "monopoly image" previously created.
From a global point of view, TSMC has now upgraded from 28nm to 20nm, 16nm and nearly 14nm processes. After the rise of Samsung, it has directly transferred from 28nm to 14nm processes, while the mature manufacturing process of SMIC is still 28nm. With the help of technical cooperation and capital means, the four companies have formed a catch-up ability in the key stage of nodes below 20 nm. While enhancing the strength of the core itself, they also promote the development of China's integrated circuit industry. If the mass production is achieved by the end of the year, it is expected to surpass the mass production of TSMC and united power, and enter the world's first process group army.
Recommended products
Latest news articles
- Zhongxin, Huawei, IMEC and Qualcomm all work together to build the most advanced integrated circuit R & D platform in China
- Looking forward to smart car chip companies busy with M & A
- Optimistic about smart car chip manufacturers busy merging Toyota's latest patent exposure: flying car research
- IPC issued the first performance requirements standard for rigid plate of automobile version
